Sealey PTC/115C Cutting Disc 115 x 3mm 22mm Bore

Sealey PTC/115C Cutting Disc 115 x 3mm 22mm Bore – Grinding Wheels & Points

The Sealey PTC/115C Cutting Disc is a high-performance accessory designed for precision cutting tasks. With a robust construction and compatibility suited for professional and DIY use, this grinding wheel delivers clean, accurate results across various materials.

• Diameter: 115mm
• Thickness: 3mm
• Bore Size: 22mm
• Material: High-grade bonded abrasive
• Suitable for: Metal and general-purpose cutting

Compared to typical grinding wheels & points available in the market, the Sealey PTC/115C Cutting Disc stands out for its increased durability and efficiency. Users transitioning from older models or industry standards will notice a marked improvement in cutting speed and lifespan. The optimised thickness and bore size ensure compatibility with a broad range of power tools, reducing downtime during equipment changes.

Key Technical Advantages: The Sealey PTC/115C Cutting Disc leverages advanced bonded abrasive technology, resulting in longer operational life and superior heat resistance. Its precise 3mm thickness minimises material wastage while maintaining structural integrity throughout extended use. The 22mm bore size offers a secure and stable fit, ensuring smoother operation and enhanced safety.

Technology and Performance This cutting disc adheres to stringent quality controls, guaranteeing consistent performance with every use. Whether utilised for metalwork, construction, or repair jobs, it provides reliable and smooth grinding, making it a preferred choice among professionals familiar with high-performance grinding wheels & points. Its robust composition allows for frequent, rigorous use without significant wear, outperforming many conventional discs in its category.

By choosing the Sealey PTC/115C Cutting Disc, users can expect precision cutting, greater productivity, and reduced tool maintenance – all key considerations when selecting the best grinding wheels & points for demanding applications.